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| GlobalOptoisolatorTM 6-Pin DIP Zero-Cross Optoisolators Triac Driver Output (800 Volts Peak) The MOC3081, MOC3082 and MOC3083 devices consist of gallium arsenide infrared emitting diodes optically coupled to monolithic silicon detectors performing the function of Zero Voltage Crossing bilateral triac drivers. They are designed for use with a triac in the interface of logic systems to equipment powered from 240 Vac lines, such as solid-state relays, industrial controls, motors, solenoids and consumer appliances, etc. * * * * Simplifies Logic Control of 240 Vac Power Zero Voltage Crossing dv/dt of 1500 V/s Typical, 600 V/s Guaranteed To order devices that are tested and marked per VDE 0884 requirements, the suffix "V" must be included at end of part number. VDE 0884 is a test option. Recommended for 240 Vac(rms) Applications: * Solenoid/Valve Controls * Temperature Controls * Lighting Controls * Static Power Switches * AC Motor Drives MAXIMUM RATINGS Rating INPUT LED Reverse Voltage Forward Current -- Continuous Total Power Dissipation @ TA = 25C Negligible Power in Output Driver Derate above 25C OUTPUT DRIVER Off-State Output Terminal Voltage Peak Repetitive Surge Current (PW = 100 s, 120 pps) Total Power Dissipation @ TA = 25C Derate above 25C TOTAL DEVICE Isolation Surge Voltage(1) (Peak ac Voltage, 60 Hz, 1 Second Duration) Total Power Dissipation @ TA = 25C Derate above 25C Junction Temperature Range Ambient Operating Temperature Range Storage Temperature Rang Soldering Temperature (10 s) VISO PD TJ TA Tstg TL 7500 250 2.94 - 40 to +100 - 40 to +85 - 40 to +150 260 Vac(pk) mW mW/C C C C C VDRM ITSM PD 800 1 150 1.76 Volts A mW mW/C VR IF PD 6 60 120 1.41 Volts mA mW mW/C Symbol Value Unit MOC3081 MOC3082 MOC3083 6 1 STANDARD THRU HOLE * E.M. Contactors * AC Motor Starters * Solid State Relays COUPLER SCHEMATIC 1 2 3 ZERO CROSSING CIRCUIT 6 5 4 1. 2. 3. 4. 5. ANODE CATHODE NC MAIN TERMINAL SUBSTRATE DO NOT CONNECT 6. MAIN TERMINAL 1. Isolation surge voltage, VISO, is an internal device dielectric breakdown rating. 1. For this test, Pins 1 and 2 are common, and Pins 4, 5 and 6 are common. MOC3081, MOC3082, MOC3083 ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) Characteristic INPUT LED Reverse Leakage Current (VR = 6 V) Forward Voltage (IF = 30 mA) OUTPUT DETECTOR (IF = 0) Leakage with LED Off, Either Direction (VDRM = 800 V(1)) Critical Rate of Rise of Off-State Voltage(3) COUPLED LED Trigger Current, Current Required to Latch Output (Main Terminal Voltage = 3 V(2)) MOC3081 MOC3082 MOC3083 Peak On-State Voltage, Either Direction (ITM = 100 mA, IF = Rated IFT) Holding Current, Either Direction Inhibit Voltage (MT1-MT2 Voltage above which device will not trigger) (IF = Rated IFT) Leakage in Inhibited State (IF = Rated IFT, VDRM = 800 V, Off State) 1. 2. 2. 3. IFT -- -- -- VTM IH VINH -- -- -- -- -- -- 1.8 250 5 15 10 5 3 -- 20 Volts A Volts mA IDRM1 dv/dt -- 600 80 1500 500 -- nA V/s IR VF -- -- 0.05 1.3 100 1.5 A Volts Symbol Min Typ Max Unit IDRM2 -- 300 500 A Test voltage must be applied within dv/dt rating. All devices are guaranteed to trigger at an IF value less than or equal to max IFT. Therefore, recommended operating IF lies between max IFT (15 mA for MOC3081, 10 mA for MOC3082, 5 mA for MOC3083) and absolute max IF (60 mA). This is static dv/dt. See Figure 7 for test circuit. Commutating dv/dt is a function of the load-driving thyristor(s) only. TYPICAL CHARACTERISTICS 1.5 +800 ITM , ON-STATE CURRENT (mA) +600 +400 +200 0 -200 -400 -600 -800 -4 -3 -2 -1 0 1 2 3 VTM, ON-STATE VOLTAGE (VOLTS) 4 5 OUTPUT PULSE WIDTH - 80 s IF = 30 mA f = 60 Hz TA = 25C 1.4 1.3 V INH, NORMALIZED 1.2 1.1 1 0.9 0.8 0.7 0.6 0.5 -40 NORMALIZED TO TA = 25C -20 0 20 40 60 TA, AMBIENT TEMPERATURE (C) 80 100 Figure 1. On-State Characteristics Figure 2. Inhibit Voltage versus Temperature MOC3081, MOC3082, MOC3083 500 I DRM1, PEAK BLOCKING CURRENT (mA) 1.5 1.4 200 IDRM2, NORMALIZED 100 50 1.3 1.2 1.1 1 0.9 0.8 0.7 0.6 5 -40 -20 0 20 40 60 80 100 TA, AMBIENT TEMPERATURE (C) -40 -20 0 20 40 60 80 100 TA, AMBIENT TEMPERATURE (C) IF = RATED IFT 20 VDRM = 800 V 10 Figure 3. Leakage with LED Off versus Temperature 25 20 Figure 4. IDRM2, Leakage in Inhibit State versus Temperature IFT, NORMALIZED LED TRIGGER CURRENT 1.5 1.4 IFT, NORMALIZED 1.3 1.2 1.1 1 0.9 0.8 0.7 NORMALIZED TO TA = 25C NORMALIZED TO: PWin 100 s q 15 10 5 0 -40 -20 0 20 40 60 TA, AMBIENT TEMPERATURE (C) 80 100 1 2 5 10 20 PWin, LED TRIGGER PULSE WIDTH (s) 50 100 Figure 5. Trigger Current versus Temperature Figure 6. LED Current Required to Trigger versus LED Pulse Width +400 Vdc RTEST 10 k PULSE INPUT CTEST MERCURY WETTED RELAY X100 SCOPE PROBE D.U.T. 1. The mercury wetted relay provides a high speed repeated pulse to the D.U.T. 2. 100x scope probes are used, to allow high speeds and voltages. 3. The worst-case condition for static dv/dt is established by triggering the D.U.T. with a normal LED input current, then removing the current. The variable RTEST allows the dv/dt to be gradually increased until the D.U.T. continues to trigger in response to the applied voltage pulse, even after the LED current has been removed. The dv/dt is then decreased until the D.U.T. stops triggering. tRC is measured at this point and recorded. Vmax = 400 V APPLIED VOLTAGE WAVEFORM 252 V dv dt tRC 0 VOLTS V + 0.63 RCmax + 504 RC t t Figure 7. Static dv/dt Test Circuit MOC3081, MOC3082, MOC3083 VCC Rin 1 6 360 HOT 39 240 Vac 0.01 LOAD NEUTRAL 2 MOC3081-83 5 3 4 330 Typical circuit for use when hot line switching is required. In this circuit the "hot" side of the line is switched and the load connected to the cold or neutral side. The load may be connected to either the neutral or hot line. Rin is calculated so that IF is equal to the rated IFT of the part, 15 mA for the MOC3081, 10 mA for the MOC3082, and 5 mA for the MOC3083. The 39 ohm resistor and 0.01 F capacitor are for snubbing of the triac and may or may not be necessary depending upon the particular triac and load used. * For highly inductive loads (power factor < 0.5), change this value to 360 ohms. Figure 8. Hot-Line Switching Application Circuit 240 Vac R1 1 Rin 2 3 MOC3081-83 6 5 4 360 SCR SCR NOTE: This device should not be used to drive a load directly. It is intended to be a trigger device only. D2 R2 LOAD D1 VCC Suggested method of firing two, back-to-back SCR's, with a Motorola triac driver. Diodes can be 1N4001; resistors, R1 and R2, are optional 330 ohms. Figure 9. Inverse-Parallel SCR Driver Circuit MOC3081, MOC3082, MOC3083 PACKAGE DIMENSIONS -A- 6 4 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. DIM A B C D E F G J K L M N INCHES MIN MAX 0.320 0.350 0.240 0.260 0.115 0.200 0.016 0.020 0.040 0.070 0.010 0.014 0.100 BSC 0.008 0.012 0.100 0.150 0.300 BSC 0_ 15 _ 0.015 0.100 STYLE 6: PIN 1. 2. 3. 4. 5. 6. MILLIMETERS MIN MAX 8.13 8.89 6.10 6.60 2.93 5.08 0.41 0.50 1.02 1.77 0.25 0.36 2.54 BSC 0.21 0.30 2.54 3.81 7.62 BSC 0_ 15 _ 0.38 2.54 -B- 1 3 F 4 PL N C L -T- SEATING PLANE K G J 6 PL 0.13 (0.005) TA M M E 6 PL D 6 PL 0.13 (0.005) M M TB M A M B M ANODE CATHODE NC MAIN TERMINAL SUBSTRATE MAIN TERMINAL THRU HOLE -A- 6 1 4 -B- 3 S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MIN MAX 0.320 0.350 0.240 0.260 0.115 0.200 0.016 0.020 0.040 0.070 0.010 0.014 0.100 BSC 0.020 0.025 0.008 0.012 0.006 0.035 0.320 BSC 0.332 0.390 MILLIMETERS MIN MAX 8.13 8.89 6.10 6.60 2.93 5.08 0.41 0.50 1.02 1.77 0.25 0.36 2.54 BSC 0.51 0.63 0.20 0.30 0.16 0.88 8.13 BSC 8.43 9.90 F 4 PL H C L -T- G E 6 PL D 6 PL 0.13 (0.005) M J K 6 PL 0.13 (0.005) TA M M SEATING PLANE TB M A M B M DIM A B C D E F G H J K L S SURFACE MOUNT MOC3081, MOC3082, MOC3083 -A- 6 4 -B- 1 3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. DIM A B C D E F G J K L N INCHES MIN MAX 0.320 0.350 0.240 0.260 0.115 0.200 0.016 0.020 0.040 0.070 0.010 0.014 0.100 BSC 0.008 0.012 0.100 0.150 0.400 0.425 0.015 0.040 MILLIMETERS MIN MAX 8.13 8.89 6.10 6.60 2.93 5.08 0.41 0.50 1.02 1.77 0.25 0.36 2.54 BSC 0.21 0.30 2.54 3.81 10.16 10.80 0.38 1.02 F 4 PL N C L -T- SEATING PLANE G D 6 PL K 0.13 (0.005) M J TA M E 6 PL B M 0.4" LEAD SPACING DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com (c) 2000 Fairchild Semiconductor Corporation |
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